工件查找步骤和故障对应

12: The results or wafer-search differ from the actual wafer condition.

When the output of wafer-search results is checked via PLC, compare the results of wafer-search between via PLC and via serial communication. When the results are different, refer to “11: The results of wafer-search differ between via Parallel I/O and via serial communication.”.

When there are wafers in the actual setting but the results show that there is no wafer, check “5: Setting of the maximum detection width of wafer (WWM setting)”. Check if it is larger than the detected width at “12: Reading out of the detection width of wafer-search”. The setting may differ from the actual detected values when, for example, wafer thickness has been set based on the calculation from the robot resolution.

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